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Intern 6 engirning

Location: Shanghai, 31, China 
Req ID: JR-0000036448


NAND PID(by generation): integration of wafer Fab, package team, test team, reliability team… Assembly process evaluation for new generation NAND NAND Device interaction with package evaluationPackaging risk assessment by checking new NAND design and fab processCo-work with assembly process engineer to develop assembly recipe for new NANDCo-work with fab team to evaluate if fab process change will effect packaging process.